| Accession number;07A0159257 |
| Title;Assembly Technology for High-Performance PCBAs |
| Author;HIGASHI OSAMU(Fujitsu Ltd.) TSUBONE KEN-ICHIRO(Fujitsu Ltd.) |
Journal Title;Fujitsu Sci Tech J
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Journal Code:S0076A
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ISSN:0016-2523
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VOL.43;NO.1;PAGE.35-40(2007)
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| Figure&Table&Reference;FIG.5, REF.6 |
| Pub. Country;Japan |
| Language;English |
| Abstract;Servers and other network equipment contain high-performance printed circuit board assemblies (PCBAs). Some PCBAs, for example, PCBAs that mount CPUs, are very large and densely populated with leading-edge electronic packages and components. These PCBAs therefore require a more efficient and precise assembly technology to manufacture than ordinary PCBAs. The behavior of these packages and components during assembly must be thoroughly understood in advance so suitable measures can be taken to protect them from damage. This paper describes an assembly technology for this type of large-scale PCBAs that are processed by reflow soldering. It also describes a technology for attaching thermal interface materials that thermally couple devices to their heatsinks. (author abst.) |
